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AH118 / ECG099
Product Features
* 60 - 3500 MHz * +24.7 dBm P1dB * +40.5 dBm Output IP3 * 20.4 dB Gain @ 900 MHz * 16.5 dB Gain @ 1900 MHz * +5V Single Positive Supply * Available in lead-free / green SOT-89 SMT Package Style
1/4 Watt, High Linearity InGaP HBT Amplifier
Product Information
Product Description
The AH118 / ECG099 is a high dynamic range driver amplifier in a low-cost surface mount package. The InGaP/GaAs HBT is able to achieve high performance across a broad range with +40.5 dBm OIP3 and +24.7 dBm of compressed 1dB power. The AH118 / ECG099 is available in a lead-free/green/RoHS-compliant SOT-89 package. All devices are 100% RF and DC tested. The AH118 / ECG099 is targeted for use as a driver amplifier in wireless infrastructure where high linearity and medium power is required. Internal biasing allows the AH118 to maintain high linearity over temperature and operate directly off a single +5V supply. This combination makes the device an excellent candidate for transceiver line cards in current and next generation multi-carrier 3G base stations.
Functional Diagram
GND 4
1 RF IN
2 GND
3 RF OUT
Applications
* Final stage amplifiers for Repeaters * Mobile Infrastructure * DBS / WLL / W-LAN * Defense / Homeland Security
Function Input / Base Output / Collector Ground
Pin No. 1 3 2, 4
Specifications (1)
Parameter
Operational Bandwidth Test Frequency Gain Input Return Loss Output Return Loss Output P1dB Output IP3 (2) IS-95A Channel Power
@ -45 dBc ACPR
Typical Performance (3)
Units
MHz MHz dB dB dB dBm dBm dBm dBm dB mA V 140
Min
60 13.5
Typ
1900 16.5 12 18 +24.7 +40.5 +18 +16.7 4.3 160 +5
Max
3500
Parameter
Frequency S21 - Gain S11 - Input R.L. S22 - Output R.L. Output P1dB Output IP3 IS-95A Channel Power
@ -45 dBc ACPR, @ -45 dBc ACLR
Units
MHz dB dB dB dBm dBm dBm dBm dB 4.0 900 20.4 -15 -12 +24.2 +40 +18.2
Typical
1900 16.5 -12 -18 +24.7 +40.5 +18 +16.7 4.3 4.8 +5 V @ 160 mA 2140 16.3 -15 -16 +24.7 +40.5
+23 +39.5
W-CDMA Channel Power Noise Figure Supply Bias 175
W-CDMA Channel Power
@ -45 dBc ACLR, 2140 MHz
Noise Figure Operating Current Range Device Voltage
3. Typical parameters reflect performance in a tuned application circuit: Vsupply = +5 V, I = 160 mA, +25 C
1. Test conditions unless otherwise noted: 25C, Vsupply = +5 V, in tuned application circuit. 2. 3OIP measured with two tones at an output power of +11 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
Ordering Information Absolute Maximum Rating
Parameter
Operating Case Temperature Storage Temperature RF Input Power (continuous) Device Voltage Device Current Junction Temperature
Part No.
AH118-89* ECG099B* AH118-89G AH118-89PCB900 AH118-89PCB1900 AH118-89PCB2140
Description
High Linearity InGaP HBT Amplifier
(lead-tin SOT-89 Pkg)
Rating
-40 to +85 C -65 to +150 C +15 dBm +6 V 220 mA +250 C
High Linearity InGaP HBT Amplifier
(lead-tin SOT-89 Pkg)
High Linearity InGaP HBTAmplifier
(lead-free/green/RoHS-compliant SOT-89 Pkg)
900 MHz Evaluation Board 1900 MHz Evaluation Board 2140 MHz Evaluation Board
Operation of this device above any of these parameters may cause permanent damage.
* This package is being phased out in favor of the green package type which is backwards compatible for existing designs. Refer to Product Change Notification WJPCN06MAY05TC1 on the WJ website. Specifications and information are subject to change without notice Page 1 of 7 June 2005
WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com
AH118 / ECG099
40 35 30 25 Gain (dB) 20 15
0
0. 2
The Communications Edge TM Product Information
1/4 Watt, High Linearity InGaP HBT Amplifier
Typical Device Data
S-Parameters (VDevice = +5 V, ICC = 160 mA, 25 C, unmatched 50 ohm system)
1.0
0.8
0.8
6 0.
2. 0
0 3.
2. 0
DB(|S[2,1]|)
DB(GMax)
0. 4
6 0.
1.0
Gain / Maximum Stable Gain
S11
Swp Max 6GHz
S22
Swp Max 6GHz
0 4.
5.0
0. 2
10.0
10.0
0.2
1.0
0.8
2.0
3.0
10 5 0 -5 -10 0 0.5 1 1.5 Frequency (GHz) 2 2.5
5.0
0.4
0.6
4.0
0
10.0
0.8
3.0
0.2
1.0
2.0
5.0
0.4
0.6
4.0
.4 -0
.4 -0
.0 -2
-0 .6
Swp Min 0.01GHz
-0 .6
.0 -2
Swp Min 0.01GHz
-0.8
-1.0
-0.8
Notes: The gain for the unmatched device in 50 ohm system is shown as the trace in black color. For a tuned circuit for a particular frequency, it is expected that actual gain will be higher, up to the maximum stable gain. The maximum stable gain is shown in the dashed red line. The impedance plots are shown from 50 - 6000 MHz, with markers placed at 0.5 - 6.0 GHz in 0.5 GHz increments. S-Parameters (VDevice = +5 V, ICC = 160 mA, 25C, unmatched 50 ohm system, calibrated to device leads)
Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang)
50 100 200 400 600 800 1000 1200 1400 1600 1800 2000 2200 2400 2600 2800 3000
-2.69 -2.16 -1.91 -1.77 -1.60 -1.45 -1.40 -1.25 -1.20 -1.17 -1.13 -1.11 -1.05 -0.99 -0.93 -0.95 -0.92
-173.38 -177.19 178.30 172.47 166.83 161.09 155.39 149.59 143.79 137.57 132.05 126.72 121.50 115.58 110.41 105.30 100.11
21.74 19.63 18.22 17.13 15.99 14.97 13.84 12.76 11.71 10.63 9.75 8.88 8.00 7.31 6.52 5.73 5.05
153.70 150.82 148.19 135.41 121.91 109.02 97.28 86.83 76.95 68.15 59.55 52.22 45.09 37.40 30.66 23.51 17.07
-31.02 -30.31 -29.87 -29.83 -29.49 -29.18 -28.70 -28.63 -28.30 -27.94 -27.63 -27.51 -27.06 -27.02 -26.78 -26.66 -26.61
11.24 7.90 5.01 4.07 2.79 2.11 1.64 -0.09 -1.34 -4.47 -7.00 -8.43 -11.00 -14.19 -18.24 -20.10 -23.28
-7.02 -5.57 -5.06 -4.77 -4.60 -4.44 -4.26 -4.14 -3.97 -4.00 -3.86 -3.84 -3.62 -3.55 -3.46 -3.34 -3.30
-1.0
-148.17 -162.45 -173.51 177.87 171.65 166.08 160.40 155.01 149.63 144.03 139.02 134.24 129.30 124.42 119.42 114.26 109.29
Application Circuit PC Board Layout
Circuit Board Material: .062" total thickness with a .014" Getek top RF layer, 4 layers (other layers added for rigidity), 1 oz copper, Microstrip line details: width = .026", spacing = .026" The silk screen markers `A', `B', `C', etc. and `1', `2', `3', etc. are used as placemarkers for the input and output tuning.
Specifications and information are subject to change without notice WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com Page 2 of 7 June 2005
-4 .0 -5. 0
-3 .0
-4 .0 -5. 0
2 -0 .
2 -0 .
-10.0
0. 4
0 3.
0 4.
5.0
10.0
-10.0
-3 .0
AH118 / ECG099
Typical RF Performance at 25C
Frequency S21 - Gain S11 - Input Return Loss S22 - Output Return Loss Output P1dB Output IP3
(+11 dBm / tone, 1 MHz spacing)
The Communications Edge TM Product Information
1/4 Watt, High Linearity InGaP HBT Amplifier
900 MHz Application Circuit (AH118-89PCB900)
900 MHz 20.4 dB -15 dB -12 dB +24.2 dBm +40 dBm +18.2 dBm 4 dB +5 V 160 mA
CAP ID= C6 C= 6.8 pF SUBCKT ID=U1 NET="AH118" C6 should be placed at the silk screen marker 'F' on the WJ evaluation board. The capacitor should be placed 13.7 @ 0.9GHz from pin 1 of the AH118
Vcc = +5 V
All passive components are of size 0603 unless otherwise noted. The diode D1 is used as over-voltage protection on the evaluation boards. It is not specifically required in the final circuit layout in a system using a DC regulator. Component R1 is shown in the silkscreen but is not used for this configuration. L2 - the 0 ohm resistor - can be removed (with a thru line) in the final circuit layout. PORT P= 1 Z=50 Ohm CAP ID= C4 C=56 pF RES ID=L2 R=0 Ohm DIODE1 ID= D1 5.6 V IND ID=L1 L=33 nH
CAP ID=C1 C=1e5 pF size 1206 CAP ID=C2 C= 56 pF CAP ID= C3 C= 1000 pF size 0805
CAP ID=C5 C= 56 pF
PORT P= 2 Z=50 Ohm
Channel Power
(@-45 dBc ACPR, IS-95 9 channels fwd)
IND ID=L3 L= 3.3 nH CAP ID=C9 C= 2.4 pF C9 should be placed between silk screen markers '8' and '9' on the WJ evaluation board. The capacitor should be placed 19.9 @ 0.9GHz from pin 3 of the AH118.
Noise Figure Device / Supply Voltage Quiescent Current
Gain
Return Loss
ACPR vs. Channel Power S22
22 21 20 19 18 17 800 850 900 Frequency (MHz) 950 1000
0 -5 -10 -15 -20 -25 800 850 900
S11
-40
IS-95, 9 Ch. Fwd, 885 kHz offset, 30 kHz Meas BW 900 MHz ,
-50
-60
-70 950 1000 12 13 14 15 16 17 18 19 Frequency (MHz) Output Channel Power (dBm)
1900 MHz Application Circuit (AH118-89PCB1900)
Typical RF Performance at 25C
Frequency S21 - Gain S11 - Input Return Loss S22 - Output Return Loss Output P1dB Output IP3
(+11 dBm / tone, 1 MHz spacing)
1900 MHz 16.5 dB -12 dB -18 dB +24.7 dBm +40.5 dBm +18 dBm 4.3 dB +5 V 160 mA
Vcc = +5 V
All passive components are of size 0603 unless otherwise noted. The diode D1 is used as over-voltage protection on the evaluation boards. It is not specifically required in the final circuit layout in a system using a DC regulator. Component R1 is shown in the silkscreen but is not used for this configuration. L3 - the 0 ohm resistor - can be removed (with a thru line) in the final circuit layout. PORT P= 1 Z=50 Ohm CAP ID= C4 C=56 pF DIODE1 ID= D1 5.6 V IND ID=L1 L=18 nH
CAP ID=C1 C=1e5 pF size 1206 CAP ID=C2 C= 56 pF CAP ID= C3 C= 1000 pF size 0805
CAP ID=C5 C= 56 pF
PORT P= 2 Z=50 Ohm
Channel Power
(@-45 dBc ACPR, IS-95 9 channels fwd)
Noise Figure Device / Supply Voltage Quiescent Current
Gain
IND ID=L2 L=4.7 nH CAP ID= C7 C=2.7 pF C7 should be placed at the silk screen marker 'A' on the WJ evaluation board. The capacitor should be placed 4.6 @ 1.9GHz from pin 1 of the AH118
SUBCKT ID=U1 NET="AH118"
RES ID=L3 R=0 Ohm
CAP ID=C9 C= 1.5 pF
C9 should be placed at silk screen marker '4' on the WJ evaluation board. The capacitor should be placed 18.4 @ 1.9GHz from pin 3 of the AH118.
Return Loss
ACPR vs. Channel Power S22 -40
IS-95, 9 Ch. Fwd, 885 kHz offset, 30 kHz Meas BW 1900 MHz ,
18 17 16 15 14 13 1800 1850 1900 Frequency (MHz) 1950 2000
0 -5 -10 -15 -20 -25 1800 1850 1900
S11
-50
-60
-70
1950
2000
12
13
14
15
16
17
18
19
Frequency (MHz)
Output Channel Power (dBm)
Specifications and information are subject to change without notice
WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com
Page 3 of 7
June 2005
AH118 / ECG099
Typical RF Performance at 25C
Frequency S21 - Gain S11 - Input Return Loss S22 - Output Return Loss Output P1dB Output IP3
(+11 dBm / tone, 1 MHz spacing)
The Communications Edge TM Product Information
1/4 Watt, High Linearity InGaP HBT Amplifier
2140 MHz Application Circuit (AH118-89PCB2140)
2140 MHz 16.3 dB -15 dB -16 dB +24.7 dBm +40.5 dBm +16.7 dBm 4.8 dB +5 V 160 mA
CAP ID= C6 C= 1.8 pF SUBCKT ID=U1 NET="AH118" C6 should be placed at the silk screen marker 'F' on the WJ evaluation board. The capacitor should be placed 32.6 @ 2.14GHz from pin 1 of the AH118
Vcc = +5 V
All passive components are of size 0603 unless otherwise noted. The diode D1 is used as over-voltage protection on the evaluation boards. It is not specifically required in the final circuit layout in a system using a DC regulator. Component R1 is shown in the silkscreen but is not used for this configuration. L3 - the 0 ohm resistor - can be removed (with a thru line) in the final circuit layout. PORT P= 1 Z=50 Ohm CAP ID= C4 C=56 pF CAP ID= L2 C= 1.5 pF DIODE1 ID= D1 5.6 V IND ID=L1 L=18 nH
CAP ID=C1 C=1e5 pF size 1206 CAP ID=C2 C= 56 pF CAP ID= C3 C= 1000 pF size 0805
CAP ID=C5 C= 56 pF
PORT P= 2 Z=50 Ohm
Channel Power
(@-45 dBc ACPR, IS-95 9 channels fwd)
RES ID=L3 R=0 Ohm
Noise Figure Device / Supply Voltage Quiescent Current
Gain
CAP ID=C9 C= 1.2 pF
C9 should be placed at silk screen marker '5' on the WJ evaluation board. The capacitor should be placed 26.7 @ 2.14G Hz from pin 3 of the AH118.
Return Loss
ACLR vs. Channel Power S22
-35 -40 -45 -50 -55 -60
3GPP W -CDMA, Test Model 1+64 DPCH, 5 MHz offset, 2140 MHz
18 17 16 15 14 13 2110 2130 2150 2170 Frequency (MHz)
0 -5 -10 -15 -20 -25 2110 2130
S11
2150
2170
12
13
14
15
16
17
18
Frequency (MHz)
Output Channel Power (dBm )
3500 MHz Application Circuit
Typical RF Performance at 25C
Frequency S21 - Gain S11 - Input Return Loss S22 - Output Return Loss Output P1dB Output IP3
(+11 dBm / tone, 1 MHz spacing)
3500 MHz 8.5 dB -12 dB -12 dB +23.5 dBm +38.5 dBm 5.0 dB +5 V 160 mA
Vcc = +5 V
All passive components are of size 0603 unless otherwise noted. The diode D1 is used as over-voltage protection on the evaluation boards. It is not specifically required in the final circuit layout in a system using a DC regulator. Component R1 is shown in the silkscreen but is not used for this configuration. L3 - the 0 ohm resistor - can be removed (with a thru line) in the final circuit layout. PORT P=1 Z=50 Ohm CAP ID=C4 C=27 pF DIODE1 ID=D1 5.6 V IND ID=L1 L=15 nH
CAP ID=C1 C=1e5 pF size 1206 CAP ID=C2 C=56 pF CAP ID=C3 C=1000 pF size 0805
CAP ID=C5 C=27 pF
PORT P=2 Z=50 Ohm
Noise Figure Device / Supply Voltage Quiescent Current
IND ID=L2 L=5.6 nH CAP ID=C7 C=0.2 pF
SUBCKT ID=U1 NET="AH118"
RES ID=L3 R=0 Ohm
CAP ID=C9 C=0.2 pF
Specifications and information are subject to change without notice WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com Page 4 of 7 June 2005
AH118 / ECG099
Outline Drawing
The Communications Edge TM Product Information
1/4 Watt, High Linearity InGaP HBT Amplifier
AH118-89 (SOT-89 Package) Mechanical Information
This package may contain lead-bearing materials. The plating material on the leads is SnPb.
Product Marking
The component will be marked with an "AH118" designator with an alphanumeric lot code on the top surface of the package. Tape and reel specification for this part is located on the website in the "Application Notes" section.
ESD / MSL Information
Land Pattern
ESD Rating: Value: Test: Standard:
Class 1A Passes between 250 and 500V Human Body Model (HBM) JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +235 C convection reflow Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135") diameter drill and have a final plated thru diameter of .25 mm (.010"). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees.
Thermal Specifications
Parameter
Operating Case Temperature Thermal Resistance (1) Junction Temperature (2)
Rating
-40 to +85 C 92 C / W 159 C
100000
MTTF vs. GND Tab Temperature
10000
Notes: 1. The thermal resistance is referenced from the hottest part of the junction to the ground tab (pin 4). 2. This corresponds to the typical biasing condition of +5V, 160 mA at an 85 C ground tab temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 247 C.
1000
100 60 70 80 90 100 110 120 Tab Temperature (C)
Specifications and information are subject to change without notice WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com Page 5 of 7 June 2005
AH118 / ECG099
The Communications Edge TM Product Information
1/4 Watt, High Linearity InGaP HBT Amplifier
AH118-89G (Green / Lead-free SOT-89 Package) Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260C reflow temperature) and leaded (maximum 245C reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Product Marking
The component will be marked with an "AH118G" designator with an alphanumeric lot code on the top surface of the package. Tape and reel specifications for this part are located on the website in the "Application Notes" section.
MSL / ESD Rating
ESD Rating: Value: Test: Standard:
Class 1A Passes between 250 and 500V Human Body Model (HBM) JEDEC Standard JESD22-A114
Land Pattern
MSL Rating: Level 3 at +260 C convection reflow Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135") diameter drill and have a final plated thru diameter of .25 mm (.010"). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees.
Thermal Specifications
Parameter
Operating Case Temperature Thermal Resistance (1) Junction Temperature (2)
Rating
-40 to +85 C 92 C / W 159 C
100000
MTTF vs. GND Tab Temperature
10000
Notes: 1. The thermal resistance is referenced from the hottest part of the junction to the ground tab (pin 4). 2. This corresponds to the typical biasing condition of +5V, 160 mA at an 85 C ground tab temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 247 C.
1000
100 60 70 80 90 100 110 120 Tab Temperature (C)
Specifications and information are subject to change without notice WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com Page 6 of 7 June 2005
AH118 / ECG099
Outline Drawing
The Communications Edge TM Product Information
1/4 Watt, High Linearity InGaP HBT Amplifier
ECG099B (SOT-89 Package) Mechanical Information
This package may contain lead-bearing materials. The plating material on the leads is SnPb.
Product Marking
The component will be marked with an "E099" designator with an alphanumeric lot code on the top surface of the package. Tape and reel specification for this part is located on the website in the "Application Notes" section.
ESD / MSL Information
ESD Rating: Value: Test: Standard:
Class 1A Passes between 250 and 500V Human Body Model (HBM) JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +235 C convection reflow Standard: JEDEC Standard J-STD-020
Land Pattern
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135") diameter drill and have a final plated thru diameter of .25 mm (.010"). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees.
Thermal Specifications
Parameter
Operating Case Temperature Thermal Resistance (1) Junction Temperature (2)
Rating
-40 to +85 C 92 C / W 159 C
100000
MTTF vs. GND Tab Temperature
10000
Notes: 1. The thermal resistance is referenced from the hottest part of the junction to the ground tab (pin 4). 2. This corresponds to the typical biasing condition of +5V, 160 mA at an 85 C ground tab temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 247 C.
1000
100 60 70 80 90 100 110 120 Tab Temperature (C)
Specifications and information are subject to change without notice WJ Communications, Inc * Phone 1-800-WJ1-4401 * FAX: 408-577-6621 * e-mail: sales@wj.com * Web site: www.wj.com Page 7 of 7 June 2005

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